乱世儿女国语免费观看,天天操开放网天天干视频,欧美亚洲精品suv,久久99精品久久久国产人妖,免费永久看黄神器,狼友基地性爱视频,99精品国产免费久久久,久久亚洲国产精品尤物

Single-Side Polisher
TSP-610/810/910/1270/1500 series
This series of polishing machines comprises high-precision single-sided polishing equipment with ceramic discs for the carrier used to polish while fixing wafers through wax pasting or wax-free adsorption. These machines can realize two-spindle and four-spindle processing at the same time and are easy to operate. They also feature strong compatibility, high stability, and good corrosion resistance. The polishing head cylinder can be actively rotated under pressure to achieve high speed and high pressure polishing. With different polishing pads and solutions, these machines are suitable for polishing various semiconductor materials.
  • Plate Specifications

    OD610 mm

  • Ceramic Plate Specifications

    OD240 mm

  • Number of Polishing Heads

    2

  • Features
    Pressurizing method
    Cylinders,accurate pressure control
    Drive mode
    Direct drive on polishing head
    Constant temperature control
    Temperature control system for polishing plate
    Process optimization
    Wax-bonding & Wax-free process
    Sufficient capacity
    Simultaneous 2 or 4 spindles are optional to meet different production needs
    Cleaning function
    PAD cleaning